Electronics Forum | Electrical Engineering Forum - PCBGOGO

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Instrumentation PCBA Micro-Pitch Soldering Technology Manual Process: Optimization and Inspection Standards

21 0 Dec 18.2025, 10:38:02

With instrumentation technology advancing toward miniaturization and high precision, PCBAs increasingly adopt micro-pitch components (pin pitch ≤ 0.5mm), such as 01005 (0.4mm × 0.2mm), BGA, and QFP. Core challenges in micro-pitch soldering include solder bridging, open circuits, and excessive void rates, with industry average defect rates of 3–5%, seriously affecting instrumentation reliability.PCBGOGO, with a Class 10,000 cleanroom and Siemens high-speed SMT machines, can place 01005 components with ±50 μm accuracy, serving top instrumentation brands such as Philips and Siemens. This article presents process optimization, inspection standards, and full-process quality control based on IPC-A-610G and PCBGOGO’s SMT experience, helping reduce defect rates to below 0.3%.Key Challenges and Industry Standards of Micro-Pitch SolderingCore DifficultiesSmall component size: 01005 pads are only 0.2mm × 0.1mm, requiring precise solder paste printing. A ±10% paste volume deviation may cause bridg...

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Instrumentation PCB Low Temperature Drift Challenge: Material and Process Optimization and Stable Solutions

23 0 Dec 18.2025, 10:37:56

Instrumentation PCBs are widely used in industrial control, outdoor monitoring, and medical equipment, where reliable operation across a wide temperature range of -40°C to 85°C is required. In such environments, low-temperature drift directly affects measurement accuracy and long-term system reliability.Industry data shows that PCBs without low-temperature drift optimization can experience:2%–5% resistance variation with a 10°C temperature changeCapacitance deviation exceeding 10%, leading to doubled measurement errorsWith nearly 10 years of experience in the electronics manufacturing industry, PCBGOGO leverages four self-owned production bases, advanced environmental testing equipment, and material R&D capabilities to deliver low-temperature drift optimized PCB solutions for instrumentation customers, including Haier, Joyoung, and Yuwell.This article analyzes the key factors influencing low-temperature drift and presents practical, full-process optimization strategies covering materia...

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How to Control Copper Balance in Multilayer PCB Production?

21 0 Dec 18.2025, 10:37:49

Even when copper balance is well controlled during the PCB design stage, warpage and delamination can still occur during mass production. The reason is simple: copper balance is not purely a design issue—it is equally a manufacturing execution problem.From substrate pretreatment to lamination and post-processing, every production step influences how well copper balance is realized in the final multilayer PCB. This article explains how to translate copper-balanced designs into stable, repeatable production results from a production and process control perspective.The Core Challenge in Production: Turning Designed Copper Balance into RealityA perfectly balanced copper layout on design drawings does not guarantee a flat, reliable PCB if production parameters are poorly controlled. Issues such as uneven lamination temperature, inconsistent pressure, or inadequate substrate pretreatment can amplify copper imbalance effects.Based on PCBGOGO’s production experience, effective copper balance...

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Why Multilayer PCB Copper Balancing Cannot Be Ignored？90% of Engineers Fall into These Traps

23 0 Dec 18.2025, 10:37:43

Multilayer PCB warpage, delamination after lamination, and yield drops in mass production are among the most common complaints engineers raise during PCB manufacturing. After repeated root-cause analysis, one issue frequently emerges as the hidden culprit: poor copper balancing.Many engineers still regard copper balancing as a minor layout detail. In reality, it has a direct and measurable impact on PCB mechanical stability, lamination reliability, and electrical performance, especially for high-layer-count and high-density designs. This article explains what copper balancing is, why it matters, and the most common mistakes engineers make.What Is Copper Balancing in Multilayer PCBs?Copper balancing refers to maintaining a relatively uniform copper area and distribution across each PCB layer, particularly between symmetrical layers (such as top vs. bottom layers, or L2 vs. L5 in an 8-layer stack-up).A multilayer PCB can be compared to a sandwich: each copper layer acts as a filling. If ...

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Common PCB Back-Drilling Faults and Troubleshooting: Pitfalls 90% of Engineers Fall Into

20 0 Dec 18.2025, 10:37:36

PCB back drilling is a widely used process in high-speed and high-layer-count PCB fabrication to eliminate via stubs and improve signal integrity. However, in real manufacturing, back-drilling defects frequently lead to yield loss, signal degradation, or even complete product scrapping.Based on years of hands-on experience with PCB back drilling, many failures—such as excessive residual copper, hole wall carbonization, drilling misalignment, and PCB delamination—follow identifiable patterns. Once the root cause is correctly identified, most issues can be resolved efficiently.This article systematically summarizes 5 common PCB back-drilling faults, analyzes their root causes, and provides practical troubleshooting and process optimization solutions to help engineers avoid costly production pitfalls.Fault 1: PCB Back-Drilling Misalignment Causing Damage to Adjacent TracesBack-drilling misalignment is the most severe failure mode in PCB manufacturing. Once adjacent signal traces are drill...

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PCB Backdrilling vs Blind Via: How to Choose the Right Solution for Your PCB

24 0 Dec 18.2025, 10:37:31

When designing high-density, high-speed PCBs, engineers often ask: "Should we use backdrilling or blind vias?" The answer isn’t absolute—it depends on your product’s requirements: cost, production volume, signal performance, and layer count. Here’s a detailed, practical comparison to help you make the best choice.1. Understanding the Core DifferencePCB Backdrilling:Drill a through-hole first → copper plating → drill again to remove excess copper.Essentially, “drill full first, then subtract,” creating a pseudo-blind via.Blind Via:Drill directly to a target inner layer (e.g., top layer to layer 2) in a single step.Essentially “drill only what’s needed,” forming a via without a second drilling step.2. Comparison Across 5 Key DimensionsDimensionPCB BackdrillingBlind ViaCostLower (30%-50% cheaper than blind vias)Higher (especially for multi-layer PCBs)AccuracyModerate (±0.005mm)High (±0.003mm)Volume SuitabilitySmall to medium batches (100–1000 pcs)Large batches (≥1000 pcs)Signal Perfor...

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4 Cost-Saving Tips for Double-Sided PCB Board: A Must-Read for Bosses and Production Managers

20 0 Dec 18.2025, 10:37:25

Controlling production costs is always a top priority for bosses and production managers, whether you’re making consumer electronics or industrial products. Many assume that a double-sided PCB board is more expensive than a single-sided one and avoid it. In reality, with the right approach, double-sided PCB boards can maintain excellent performance and save money compared to single-sided boards.As a PCB industry expert with over 10 years of experience, Im sharing four practical cost-saving tips for double-sided PCB boards that help reduce unnecessary expenses.1. Optimize Panelization to Increase Material Utilization by 20%Material costs account for 30–40% of a double-sided PCB board’s total cost. Maximizing material utilization is the first step to saving money.Double-sided boards allow more flexible panelization since components can be placed on both sides, reducing the need for large process margins. Smart panel designs can increase material utilization from 70% (typical for single-s...

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Why Does Double-Sided SMT Soldering Offer Superior Reliability Than Single-Sided? 4 Key Reasons

20 0 Dec 18.2025, 10:37:18

In PCB manufacturing, double-sided SMT soldering is increasingly recognized for delivering higher reliability than single-sided assembly. For electronics used in industrial control, automotive, or high-performance applications, solder joint quality directly affects product lifespan, performance, and safety.Single-sided SMT boards may suffer from cold solder joints, pad lifting, uneven heat dissipation, and stress-induced failures. In contrast, double-sided SMT soldering significantly improves reliability, often reducing defect rates from 3–5% to below 1%. Here are four practical reasons why double-sided SMT soldering is superior.1. More Even Heat Distribution Prevents Thermal DamageHeat is the most critical factor affecting solder joint quality. Single-sided boards have copper only on one side, which limits heat dissipation during reflow soldering. This can lead to localized overheating, incomplete solder wetting, or even component damage.Double-sided SMT boards have copper on both sid...

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How does Double-Sided SMT PCB: Practical Techniques to Maximize Space in Compact Electronics

21 0 Dec 18.2025, 10:34:18

In today’s electronics market, miniaturization and lightweight design are no longer optional—they are competitive requirements. From smartphones and smartwatches to portable medical devices and wireless earbuds, products are expected to be smaller, thinner, and easier to carry, while still integrating more functions than ever before.This creates a familiar challenge for engineers: The component count keeps increasing, but PCB size must shrink.One of the most effective and proven solutions is double-sided SMT PCB assembly. By utilizing both sides of the board for component placement, designers can significantly increase space efficiency without compromising performance or reliability. Based on real production experience, the following practical techniques explain how double-sided SMT helps products “slim down” in real-world applications.1. Functional Zoning on Both Sides: Use Space Without Creating InterferenceThe essence of double-sided SMT is space reuse, but effective reuse require...

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Why Is Double-Sided SMT the Best Choice for Low- to Mid-Volume PCB Production? 3 Key Points Answer you

22 0 Dec 16.2025, 09:17:50

One of the most common questions we hear is: Should we use single-sided SMT, double-sided SMT, or jump straight to multilayer boards? Based on over a decade of hands-on experience in PCB manufacturing and assembly, the answer is clear for most small and medium batch projects: double-sided SMT assembly board offers the best overall balance of functionality, cost, and flexibility.Single-sided boards are inexpensive, but quickly hit design limits. Multilayer boards deliver performance, but often exceed budget expectations for small runs. Double-sided SMT sits right in the middle—and that is exactly why it has become the preferred solution. Below are the three core advantages that make double-sided SMT assembly the go-to option for low- and mid-volume production.1. Higher Component Density Without Increasing Board SizeModern electronic products are getting smaller every year. Wearables, portable devices, and compact IoT products leave designers with very little PCB real estate to work ...

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