Electronics Forum | Electrical Engineering Forum - PCBGOGO

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DIP vs SMT Assembly: Key Differences and Which One Is Right for You

20 0 Dec 26.2025, 09:35:46

In modern electronics manufacturing, DIP vs SMT assembly represents the two main approaches for PCB component mounting. Each method has unique advantages and limitations, making them suitable for different production requirements and product designs. This article explores the major differences, helping engineers and manufacturers choose the right approach for their applications.DIP vs SMT Assembly: Side-by-Side ComparisonTo help you quickly compare the two approaches, here’s a summary table of the key differences:Comparison PointDIP AssemblySMT AssemblyComponent Type & MountingThrough-hole components with pinsSurface-mount components, small or no pinsInstallation & SolderingInsert into holes, wave/manual solderingPick-and-place and reflow solderingPCB Design & LayoutWider spacing, simpler layoutHigh-density, precise pad arrangementAutomation & EfficiencyLower automation, slower productionHigh automation, faster productionSpace UtilizationLarger components, more PCB areaCompact, can use...

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Through-Hole Solder Overflow on PCB Boards: Causes and Prevention Strategies

15 0 Dec 26.2025, 09:35:40

Through-hole solder overflow is one of the most frequent defects encountered in THT (Through-Hole Technology) PCB assembly. This failure mode occurs when molten solder escapes from the plated through-hole barrel and spreads onto the opposite pad, adjacent traces, or inner board gaps. Besides affecting surface cleanliness, overflow increases the risk of electrical shorts, voids, and unreliable solder joints that undermine long-term product reliability.From a technical standpoint, overflow happens when the balance of forces acting on molten solder is disrupted. During soldering, solder flow is controlled by a combination of surface tension, gravity, and the adhesion of the metallized hole wall. When these forces fall out of equilibrium, the solder loses stability and leaks beyond the control of the pad geometry.1. Root Cause: Design-Level Issues in Pad and Hole SizeErrors originating in the PCB layout phase are the most fundamental triggers of solder overflow. Some engineers focus only o...

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Common PCB Ground Plane Design Mistakes in EMC and How to Fix Them

15 0 Dec 26.2025, 09:34:53

In PCB layout, seemingly small mistakes in ground plane design often lead to major failures in EMC compliance testing. Engineers may spend weeks optimizing a board, only to discover during certification that ground plane issues are driving excessive radiation or noise. This results in repeated redesigns, increased cost, and delayed product launches.This article highlights the most frequent PCB ground plane design mistakes that impact electromagnetic compatibility, along with corrective actions and real examples from PCBGOGO’s engineering practice.Mistake 1: Excessive Ground Plane Segmentation Creating Isolated IslandsA common error is splitting the ground plane into multiple independent zones such as analog ground, digital ground, and power ground, without providing controlled connections. While the intention is noise isolation, the real outcome is often the opposite. When return paths are broken, high-frequency currents are forced to return through unintended routes, increasing radiat...

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PCB Stackup Design: The Core to Boosting Multilayer PCB Performance

13 0 Dec 26.2025, 09:34:33

In today’s high-density electronics landscape, multilayer PCBs have become standard across consumer electronics, industrial control systems, and automotive applications. A board’s electromagnetic compatibility, signal integrity, and thermal performance all depend on one foundation: its PCB stackup design. Contrary to the idea that stackup is merely layer stacking and lamination, it is a structured engineering process that balances electrical behavior, manufacturability, and cost.What PCB Stackup Design Really MeansAt its core, stackup design arranges conductive layers, dielectric layers, ground planes, and power planes in a calculated sequence with defined thickness ratios. The goal is to ensure signal, power, and ground systems operate in coordination rather than conflict.For example, in PCBGOGO’s years of experience producing multilayer boards for consumer electronics, a classic 6-layer smartphone motherboard structure might be:L1 Top SignalL2 GroundL3 Inner SignalL4 Inner SignalL5 P...

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Symmetric vs Asymmetric PCB Stackup: How to Choose the Right Structure for Multilayer Design

11 0 Dec 26.2025, 09:34:26

In multilayer PCB engineering, the choice between symmetric and asymmetric stackup structures is one of the most influential decisions in the entire design cycle. This selection affects not only manufacturability, but also electrical performance, mechanical stability, and the long-term reliability of the final product. Selecting the wrong approach can result in lamination issues such as board warpage, resin squeeze-out, layer misalignment, and even signal integrity problems.After years of hands-on manufacturing experience, PCBGOGO has developed a proven methodology for choosing between symmetric and asymmetric PCB stackups, allowing engineers to match design intent with real-world production constraints.Understanding Symmetric PCB StackupsA symmetric stackup is arranged so that the center plane of the PCB acts as the axis of symmetry. On both sides of this plane, the build-up is configured with the same core thickness, copper weights, prepreg type, and dielectric thickness.This structu...

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Power and Ground Plane Planning in Multilayer PCB Stack-Up for Optimal Signal Integrity

19 0 Dec 24.2025, 09:56:45

In multilayer PCB stack-up design, the planning of power planes and ground planes is crucial to ensure power integrity (PI) and signal integrity (SI). These planes are not merely carriers for power and ground; they provide low-impedance reference paths for signal transmission and play a key role in suppressing electromagnetic interference (EMI). Leveraging years of PCB design and manufacturing experience, PCBGOGO has developed effective techniques for power and ground plane layout that enhance the performance of multilayer boards.Optimal Plane Layer ArrangementThe sequence of power and ground planes directly impacts signal quality. A classic “Signal – Ground – Power – Signal” stack-up is preferred for high-speed PCBs. In this structure, signal layers are adjacent to ground planes, providing a low-impedance reference that reduces signal reflection and crosstalk. The proximity of ground and power planes creates parasitic capacitance, acting as a high-frequency decoupling network to stabi...

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High-Frequency PCB Stack-Up Design: Material Selection and Impedance Control

15 0 Dec 24.2025, 09:56:35

In high-frequency electronics, such as 5G communications, RFID, and satellite navigation, the main challenge of high-frequency PCB stack-up design is minimizing signal loss and achieving precise impedance control. Both objectives rely heavily on proper material selection and scientific impedance management strategies. PCBGOGO, as a professional high-frequency PCB manufacturer, leverages deep understanding of material properties and design processes to deliver stack-up solutions optimized for high-frequency applications.1. Material Selection for High-Frequency PCBsMaterial choice is the first critical step in high-frequency PCB stack-up design. The focus is on three key parameters: dielectric constant (Dk), dissipation factor (Df), and coefficient of thermal expansion (CTE).Dielectric constant (Dk) directly affects signal propagation speed; lower Dk values allow faster transmission.Dissipation factor (Df) determines signal energy loss; lower Df reduces high-frequency attenuation.Thermal...

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HDI PCB Buried and Blind Vias: Design, Fabrication, and Yield Optimization

17 0 Dec 24.2025, 09:56:29

In the field of high-density interconnect (HDI) PCBs, the integration of buried and blind vias with advanced PCB stack-up design is a key pathway for achieving compact, high-performance electronics. Buried and blind via technology reduces surface via count and enhances routing density, while a well-planned stack-up ensures the reliability and electrical performance of the vias. At PCBGOGO, we combine stack-up design and via technology in HDI PCB R&D and manufacturing to deliver solutions that meet the demands of modern high-end electronic devices.1. Understanding Buried and Blind ViasBuried vias are located entirely within inner layers of the PCB and do not extend to the surface, connecting only internal signal layers. Blind vias, on the other hand, connect a surface layer to one or more internal layers but do not pass through the entire board. Compared with through-holes, buried and blind vias save surface space, shorten signal paths, and reduce electromagnetic interference (EMI).In s...

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Wave Soldering Solder Bridging Prevention: Parameter Optimization for PCB Through-Hole Assembly

16 0 Dec 24.2025, 09:56:23

In PCB through-hole assembly, solder bridging during the wave soldering process is a recurrent defect that directly affects product reliability, yield, and delivery stability. Even minor deviations in process settings can cause solder to overflow from plated through-holes, resulting in solder bridges, contamination, and electrical reliability risks. For manufacturers, improper parameter control translates to rework, increased scrap rates, and production delays.This article focuses on wave soldering solder bridging prevention through parameter optimization, based on PCBGOGO’s verified production standards and engineering experience.1. Why Wave Soldering Parameters Cause Solder BridgingWave soldering performance is driven by five interdependent parameters:Solder temperaturePreheating temperatureConveyor/transport speedWave heightWave angleAny misalignment in one parameter disrupts the balance of solder viscosity, wettability, and filling pressure in the through-hole, resulting in defects...

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4 Key Design Strategies to Prevent PCB Through-Hole Pad Solder Spill

17 0 Dec 24.2025, 09:56:17

In the complete chain of PCB fabrication and assembly, the design stage serves as the first line of defense for product quality. To fundamentally prevent solder spill on through-hole pads, engineers must integrate spill-prevention principles during the PCB design phase instead of relying on corrective actions during assembly. Drawing from PCBGOGO’s experience in integrated PCB design and manufacturing, the following techniques highlight how to control solder spill at its source.1. Optimal Pad and Drill Size Ratio: Core Principle for Spill PreventionA common misconception in PCB design is assuming that the closer the fit between the hole diameter and component lead, the stronger the solder joint. However, when the gap is less than 0.1 mm, molten solder cannot flow and fill efficiently, causing pressure buildup and overflow onto the pad surface. Conversely, if the gap exceeds 0.3 mm, excessive solder volume increases the spill.According to PCBGOGO’s design criteria:The drill diameter sho...

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