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Dec 05.2025, 15:15:59
As consumer electronics continue their rapid evolution toward thinner, lighter, and smaller devices, PCB thickness has shrunk from the traditional 1.6 mm to 0.8 mm—or even 0.4 mm in ultra-thin designs. With this trend, panel cracking during depaneling has become a critical reliability challenge. Industry data shows that thin PCB panel cracking rates typically reach 5%–8%, and one TWS earphone manufacturer once reported 30% corner-cracking during mass production due to stress concentration during board separation—resulting in more than USD $200,000 in losses.PCB cracking is not just a cosmetic defect. It can cause circuit fractures, impedance discontinuity, and transmission failures, ultimately degrading product reliability. With deep manufacturing experience in thin PCBs, PCBGOGO applies structural optimization, precise process control, and high-toughness materials to keep panel cracking rates below 0.1%.This article combines IPC-6012 and IPC-2221 design guidelines with PCBGOGO’s pract...
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