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Advanced PCB Manufacturing

Advanced High-quality PCB Manufacturing Capabilities

No.ItemProcess capability parameter
1PCB typeRigid PCB
2Base MaterialSee Below “Material” Chart
3Layer Count1-40 layers
Finished Copper Thickness0.5-6 oz
5Min trace width/spacingInner layer2 / 2mil
6Outer layer2.5 / 2.5mil
7Min Spacing Between Hole to Inner Layer Conductor7mil
8Min Spacing Between Hole to Outer Layer Conductor6mil
9Min Annular Ring for Via3mil
10Min Annular Ring for Component Hole6mil
11Min BGA Diameter8mil
12Min BGA Pitch0.1mm
13Min Hole Size0.15mm(CNC)|0.1mm(Laser)
14Max Aspect Ratio12:1
15Min Soldermask Bridge Width3mil
16Soldermask / Circuit Processing MethodFilm | LDI
17Min Thickness for Insulating Layer2mil
18HDI & Special Type PCBHDI(1-3 steps)|High frequency mix-pressing (2-14 layers)|Buried capacitance & resistance, etc.
19Surface FinishENIG|HAL|HAL lead free|OSP|Immersion Tin|Immersion Silver|Plating Hard Gold|Plating Silver
20Max PCB size500*600mm

Advanced PCB High Performance Materials

ItemMaterial for PCB PrototypeMaterial for Small and Medium Batch
General Tg FR4shengyi S1141, Kingboard KB6160Ashengyi S1141
High-Tg Halogen-freeshengyi S1170G Halogen-free TG170, TU-862 HF TG170 shengyi S1170G Halogen-free TG170 ,TU-862 HF TG170 
Medium Tg Halogen-freeshengyi S1150G Halogen-free TG150shengyi S1150G Halogen-free TG150
High Halogen-free CTIshengyi S1151G( CTI≥600V)shengyi S1151G( CTI≥600V)
High CTIshengyi S1600( CTI≥600V)Kingboard KB6160Cshengyi S1600( CTI≥600V)Kingboard KB6160C
Special Material (High low temperature)shengyi SH260shengyi SH260
High Tg FR4S1000-2, S1000-2M, IT180AS1000-2, S1000-2M, IT180A
Ceramic Powder Filled High FrequencyRogers4003, Rogers4350, Arlon25N, shengyi S7136Rogers4350, Rogers4003, shengyi S7136
PTFE High Frequency MaterialRogers, Taconic, Arlon, Taizhou wanglingRogers, Taconic, Arlon, Taizhou wangling
High Frequency PCB PPRO4450 0.1mm, shengyi Synamic6RO4450 0.1mm, shengyi s6

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