Electronic Project Engineer's Best Partner!

Why Choose PCBgogo?

Over 20,000 m² of Standardized Production Facilities
PCBgogo operates self-owned PCB production facilities covering over 20,000 m². This gives us the production capacity and process control needed for demanding advanced PCB projects. Whether you need a quick prototype, a small production run, or larger-volume orders, we can support a wide range of board types and order sizes. Our standardized facilities also help ensure stable quality and reliable delivery across every stage of production.
Advanced Manufacturing Processes for Complex PCB Designs
Advanced PCBs require more than standard manufacturing. PCBgogo is equipped with advanced PCB processes and automated production equipment for complex designs. From fine traces and dense layouts to controlled impedance and special materials, we focus on precision throughout the manufacturing process. This helps deliver reliable boards for products that require high performance, compact size, and stable signal transmission.
Fast Turnaround with PCB Assembly Support
PCBgogo combines quick-turn PCB manufacturing with reliable PCB assembly services to help simplify your supply chain. Our experienced production team can support your project from PCB fabrication to assembly, helping reduce coordination time and speed up product development. Whether you are testing a new design or preparing for mass production, we help you move forward with greater speed and confidence.

Advanced PCB Showcase

PCBgogo delivers advanced PCB manufacturing for designs that demand greater precision, tighter tolerances, and dependable electrical performance. Our capabilities support complex technologies such as multi-stage HDI, blind and buried vias, fine-line routing, controlled impedance, high-frequency materials, heavy copper construction, and rigid-flex structures. From compact consumer devices to industrial control, 5G communications, medical equipment, and automotive electronics, we manufacture complex PCBs built for high-density, high-speed, and reliable performance. Whether your project requires compact layouts, stable high-frequency signals, improved thermal performance, or high-current capability, PCBgogo helps turn challenging PCB designs into production-ready boards.

HDI
3rd-order-HDI-PCB-buried-
resistor-circuit-board
HDI
Ipad-3rd-order-HDI-board
HDI
HDI-second-order-6-layer-
immersion-gold
HDI
3rd-order-5G-IoT-HDI-PCB
HDI
Industrial-control-5th-order-HDI-board
HDI
10-layer-2nd-order-HDI-board
HDI
3rd-order-HDI-board
HDI
Mobile-phone-3rd-order-HDI-board
HDI
6th-order-arbitrary-interconnection-HDI-buried
HDI
HDI-second-order-12-layer
HDI
Automotive-communication-2nd-order-HDI-board
HDI
2nd-order-HDI-buried
HDI
2nd-order-high-speed-PCB
Ceramic PCB
multi-array-ceramic-substrate-panel
Ceramic
multi-array-LED-ceramic-substrate-panel
Heavy Copper
16-layer-PCB-for-new-energy-vehicles
Heavy Copper
communication-power-module-PCB
Rigid-Flex PCB
multilayer-rigid-flex-board-with-flex-interconnect
Rigid-Flex PCB
Round sensor module rigid-flex pcb assembly board
Rigid-Flex
multi-unit-rigid-flex-PCB
Rigid-Flex
PCB-dual-board-rigid-flex-interconnect-PCB
Rigid-Flex
PCB-multi-board-rigid-flex-BGA
Rogers
embedded-chip-rf-microwave-PCB
Rogers
high-frequency-rf-power-PCB
Item Standard PCB Advanced PCB
Material Standard FR-4 High-Tg, low-loss, RF, thermally enhanced materials
Typical Applications Consumer electronics, Household devices, Basic control boards, General-purpose electronics 5G communications, RF & microwave, Medical equipment, Automotive electronics, Industrial control, Aerospace, High-performance computing, Compact smart devices
Typical Board Structures Single-sided, Double-sided HDI, Multilayer, Rigid-flex, RF, High-speed, Heavy-copper, IC substrates
Drilling Mechanical holes: ≥0.20 mm Mechanical holes: ≥0.15 mm, Laser vias: ≥0.10 mm
PTH Copper ≥20μm ≥18μm
Power and Thermal Management General thermal requirements Heavy copper structures, High-current designs, Improved heat dissipation, Thermal management
Manufacturing Complexity Conventional stackups, standard PCB fabrication Complex stackups, Lamination, Impedance control, Customer-specific requirements
Test method AOI, electrical testing AOI, Electrical, Flying-probe/fixture, Impedance, Microsection, Custom testing
Glass transition ℃ >130℃ >140℃
Routing and Interconnect Density Conventional trace widths/spacing, Through-hole interconnects Fine-line routing, Fine-pitch, Microvias, Blind/buried vias, Multi-stage HDI
Signal Performance General electronic signals, Standard circuit requirements Controlled impedance, High-speed signal integrity, Low-loss transmission, Stable RF performance
Standard IPC requirements, customer specifications IPC Class 2/3 reliability, Specific reliability requirements
Documentation and Packaging Standard documentation, Standard packaging Inspection/test reports, CoC, MSL packaging, Custom packaging
Cleanliness Meet IPC standards Beyond IPC requirement
Certification UL, ISO9001:2015, RoHS etc. UL, ISO9001:2008, ISO14001:2004, ISO/TS16949:2009, RoHS etc.

Material & Processing Options

As printed circuit board technology evolves and electronics keep shrinking, it is vital to select matching base materials, surface finishes and extra fabrication options. Our facility owns professional equipment to implement all specialty processes for advanced HDI circuit board designs.

Base Materials
Surface Finishes
Additional Fabrication Options
HDI
  1. Layer Count: 1-40 layers.
  2. Finished Copper Thickness: 0.5–6 oz.
  3. Materials: Isola 370HR, ITEQ IT180A, Shengyi S1000-2M and S1170G, etc.
  4. Surface Finishes: ENIG, HASL, lead-free HASL, OSP, immersion tin, immersion silver, hard gold, and gold fingers.
  5. Maximum PCB Size: Single-sided and double-sided PCBs: 600 × 1200 mm, Multilayer PCBs: 560 × 1150 mm.
  1. Board Thickness: 0.8-2.0mm.
  2. Plated Through-hole size: ≥0.2mm.
  3. Thermal Conductivity (ω/m-k): 1W, 2W, 3W, 8W, 12W.
  4. Copper Thickness: 1oz, 2oz, 3oz, 4oz.
  5. Additional Fabrication Options: Countersunk Holes, Half Holes, Custom Stack-up, etc.
  6. Certification: ISO9001, UL, RoHS, REACH.
  1. Board Thickness: 0.8-2.0mm.
  2. Plated Through-hole size: ≥0.2mm.
  3. Thermal Conductivity (ω/m-k): 2W, 3W, 8W, 12W.
  4. Copper Thickness: 1oz, 2oz, 3oz, 4oz, 5oz.
  5. Additional Fabrication Options: Countersunk Holes, Half Holes, Custom Stack-up, etc.
  6. Certification: ISO9001, UL, RoHS, REACH.
  1. Base Materials: Rogers RO4003C, Rogers RO4350B.
  2. Outer Layer Copper Thickness: 1 oz, 2 oz, 3 oz.
  3. Inner Layer Copper Thickness: 1 oz, 1.5 oz.
  4. Minimum Trace / Space: 3 mil / 3 mil.
  5. Minimum Finished PTH Size: ≥0.20 mm.
  6. Additional Options: Hybrid Stackup, Controlled Impedance, Via-in-Pad, Blind Vias, Buried Vias, Gold Fingers.
  1. Material: Polyimide Flex+FR4.
  2. Board Thickness: 0.4~3.2mm.
  3. Min. Hole Size: ≥0.15mm.
  4. FPC Thickness: 0.13mm, 0.15mm, 0.18mm, 0.2mm.
  5. Finished Copper: 0.5oz, 1oz, 1.5oz, 2oz.
  6. Special Specification: Half-cut/Castellated Holes, Impendence Control, Layer Stackup.
  1. Layer Count: 1–14 Layers.
  2. Base Materials: Rogers RO4003C, RO4350B; PTFE and hybrid RF material.
  3. Copper Thickness: Signal Layers 0.5 oz / 1 oz; Outer Layers up to 3 oz; Inner Layers up to 1.5 oz.
  4. Impedance Tolerance: ±3%.
  5. Surface Finishes: ENIG, Immersion Silver, OSP, Lead-Free HASL, Hard Gold.

Capabilities of PCBgogo

PCBgogo provides flexible manufacturing solutions for advanced PCB designs, from material selection and surface finishes to specialized fabrication processes. Our capabilities support HDI, Rogers and RF PCBs, rigid-flex boards, heavy copper PCBs, and other complex multilayer designs that require high density, controlled impedance, reliable thermal performance, and consistent quality.

Category Item Capability
PCB Types & Layers Rigid PCB 1-40 layers
Metal-Core PCB 1-2 layers
HDI PCB 4-14 layers
Rogers PCB 1-14 layers
Materials FR-4 Yes
High TG Up to Tg 170
Halogen Free Yes
High Frequency Yes
Max PCB size Single-layer and double-layer: 600*1200mm Multi-layers: 560*1150mm
PCB thickness 1 Layer/2 Layers: 0.2~2.4mm
4 Layers: 0.4~2.4mm
6 Layers: 0.8~2.4mm
8 Layers: 1.0~2.4mm
10 Layers: 1.2~2.4mm

Note: Customized PCB thickness and Layer stack up are acceptable.
Min width 3mils
Min space 3mils
Outer Layer Copper Thickness 1oz/2oz/3oz (35μm/70μm/105μm)
Note:
2oz
PCB thickness≥1.2mm,
Via size≥0.25mm,
Min Track/Spacing≥0.15mm

3oz
PCB thickness≥2.0mm,
Via size≥0.3mm,
Min Track/Spacing≥0.2mm
Inner Layer Copper Thickness 1oz/1.5oz (35μm/50μm)
Min CNC finished aperture 0.15mm
Min Laser finished aperture 0.1mm
Max aspect ratio 12 : 1
Solder mask color Green/Red/Yellow/Blue/White/Purple/Black/Matte black/Matte green/None
Impedance control tolerance Yes
Min annular ring 3mil
Panelization V-scoring, Tab-routing, Tab-routing with Perforation (Stamp Holes)
View Full Manufacturing Capabilities

Explore detailed PCB manufacturing capabilities, including layer count, material options, copper thickness, drilling, tolerances, surface finishes, and advanced fabrication processes. For complex or custom PCB requirements, contact via service@pcbgogo.com for tailored manufacturing support.

Application Solutions

Specialized in high-precision circuit board technology, we provide full-process, one-stop services to meet strict industrial manufacturing standards.

Consumer Electronics

Consumer Electronics

HDI, flexible PCBs (FPCs), and rigid-flex PCBs are widely applied in smartphones, tablets, wearable devices, AR/VR products, and laptops for compact, integrated consumer devices.

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Medical Devices

Medical Devices

Stable, low-noise, and highly reliable PCBs are used in CT and MRI systems, ultrasound equipment, patient monitors, surgical robots, and in-vitro diagnostic devices.

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Automotive Electronics

Automotive Electronics

High-reliability PCBs are essential for smart cockpits, autonomous-driving domain controllers, electric-drive systems, battery management systems, and in-vehicle radar.

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Industrial Control

Industrial Control

Advanced PCBs are used in PLCs, industrial robots, machine-vision systems, frequency converters, CNC equipment, and smart-grid systems.

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Servers & Data Centers

Servers & Data Centers

High-speed, high-power, and thermally efficient PCBs support AI servers, GPUs, accelerator cards, storage systems, and networking equipment with reliable processing and cooling.

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Aerospace & Defense

Aerospace & Defense

High-reliability, multilayer, high-frequency PCBs are applied in avionics, satellite systems, airborne radar, guidance systems, unmanned aerial vehicles, and naval electronics.

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New energy systems

New energy systems

Thick-copper and high-power PCBs are commonly used in photovoltaic inverters, energy-storage systems, EV charging stations, wind-power controllers, and BMS solutions.

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Security & Surveillance

Security & Surveillance

Multi-layer & fine-line PCBs for IP cameras, video servers, access control systems and intelligent surveillance equipment with stable signal transmission.

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Resource Hub

What is an advanced PCB?

Advanced PCBs refer to high‑performance circuit boards including HDI, rigid‑flex, multilayer, fine‑line and high‑frequency boards, designed for miniaturization, high‑speed signal and high‑reliability application scenarios.

What files are needed for an advanced PCB quote?

Provide Gerber or ODB++ files, drill files, a board outline, stackup details, and impedance requirements when applicable.

Can PCBgogo provide PCB assembly for advanced PCB projects?

Yes. PCBgogo provides one-stop PCBA services that combine PCB fabrication, component sourcing, and assembly in one coordinated workflow. Our experienced team supports advanced PCB projects from prototype validation through production, helping reduce handoffs, improve quality control, and speed up delivery.

Can PCBgogo manufacture PCBs with blind, buried, and microvias?

Yes. We support advanced via structures for HDI and high-density PCB designs, with the final process confirmed through a manufacturability review.

What is the typical lead‑time for advanced PCB prototypes and mass production?

Prototype lead‑time for advanced PCBs ranges from 3-5 days depending on design complexity and material availability. For urgent projects, we also provide 24-hour expedited service. Mass‑production lead‑time will be confirmed in formal quotation.

Do you offer stack‑up design suggestion for high‑speed advanced PCBs?

Of course. Before production, PCBgogo’s experts review your order for manufacturability and provide practical recommendations and optimization solutions to support reliable production and strong product performance.

What materials can be used for advanced PCB manufacturing?

Common options include Shengyi S1141 and S1000-2M, Kingboard KB6160A and KB6160C, ITEQ IT180A, and Rogers. We also support PI and PET for flexible PCBs, polyimide with FR-4 for rigid-flex PCBs, and many more material options, contact us via service@pcbgogo.com to select the best fit for your design.

What factors will affect advanced PCB final cost?

Layer count, minimum trace & space, board thickness, material type, surface finish, panel size, testing and order quantity are the main factors.

Advanced PCB Solutions, Built for What’s Next

From high-density HDI to high-speed and high-reliability boards, we deliver the precision and engineering expertise your most demanding projects require.