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PCB LAYOUT CAPABILITIES

The max.
number of layers:
40 Layers The min.
trace width:
2mil(HDI)
The max.
number of pins:
60000 The min.
trace spacing:
2mil(HDI)
The min.
spacing of BGA:
0.2mm The max.
number of BGA-PIN:
2500
The highest
speed of signal:
12G(differential signal) The highest
price of HDI:
connected with any layers(ELIC)

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