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When used to use leaded solder, how is soldering BGA
I have been doing a lot of "conventional stuff" with QFP, LCC etc. I have always wanted to get into handling BGA's for prototyping and have now my first testboard with BGA's on it (CPU + SDRAM), this is just a board with no real use, just to check BGA mounting etc.
I have preheat equipment, hotair etc. I have always used leaded solder for prototyping as this was much easier. But, when I get my hands on the BGA stuff they already comes with balls (obviously) which are lead free! I guess I have a fear for the higher temperatures/handling of the non leaded stuff, but do I have to be afraid or is this really just "business as usual" although with a little higher temperatures ... ?
The packages are 180 and 54 pins with 0.8 mm spacing,also, do any of you solder lead free BGAs using leaded paste ? When searching it seems that some say its "ok" and some say "dont do this"...
Any real world experience from fellow engineers ?
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