PCBgogo

We can only give a limited recommendation for coating vias (plated-through holes) with solder-stop. Please refer to our Design Aid Via Covering.

You should pay special attention to solder-stop bridges (solder-stop between two pads or vias), which should not be smaller than 100µm (green solder-stop) and 150µm (coloured solder-stop) respectively.

Solder-stop parameters (colour: green)


Solder-stop parameters (colour: red, blue, white, black)


Exemption of component holes


For component holes, please ensure a clearance (spacing between copper to solder-stop) of at least 50µm (green solder-stop).

This clearance should be larger if possible (75µm), to avoid manufacture with extreme tolerances.

For other colours, the minimum solder-stop clearance is 75µm.

The smallest possible solder-stop bridge width is 100µm (green) or 150µm (other colours), respectively.

Exemption of SMD pads (fine pitch)


The minimum solder-stop clearance for SMD pads should at least be 50µm, better: 75µm.

For other colours than green, the min. solder-stop clearance is 75µm.

The smallest possible solder-stop bridge width is 100µm (green) or 150µm (other colours), respectively.

BGA (Ball Grid Array)


The following possibilities exist for BGAs (for explanation see Via Covering):

■Via Tenting
■Via Filling
■Via-in-Pad

You should consult your assembly partner when selecting an appropriate surface, normally our customers select immersion tin or immersion gold.