PCBgogo

At Bare Board Group, the need of each individual customer is important to us. We strive to provide our clientele with an expanded catalog of manufacturing capabilities in order to fit the wide variety of quality printed circuit boards (PCBs) they require. Below you will find a listing of Bare Board Group's standard manufacturing capabilities. If you require something that is not listed, please contact BBG to give us the opportunity to accommodate YOUR individual need.

Standard Materials
FR-4 170TG
Rogers CEM
Aluminum  Nelco
Halogen Free Dupont LF & RF Series
Taconic  

• Standard Technologies  
  Double Sided Multi Layer
  Rigid Flex Metal Core
  Flex Thermal
  Buried Resistance/Capacitance Conductive/Non-Conductive Filled Vias
  Cu Filled Vias

   

• Standard Panel  
  Largest PCB Size 20 x 30 inches
  Layer Count 1-26 Layers
  Min Rigid Board Thickness 0.010"
  Max Rigid Board Thickness 0.250"
  Board Thickness Tolerance +/- 10%
  Routing Tolerance +/- 0.005

• Standard Drill
  Min PTH Mechanical 0.008" (0.23 mm)
  Min Laser Drill 0.002"
  PTH Tolerance +/- 0.003 (0.076 mm)
  Aspect Ratio (THK: DHS) 10:1

• Standard Copper
  Max Copper Inner Thickness 3 oz
  Max Copper Outer Thickness 6 oz
  Min Copper Thickness 0.5 oz
   
  Standard Trace / Space
  Min Trace/Space 0.0035/ 0.0035

• Standard Surface Finishes
  Lead Solder (HASL) Lead-Free Solder (HASL)
  Hard Gold Immersion Gold (ENIG)
  Soft Gold OSP
  Immersion Silver Immersion Tin

Options
Gold Fingers Selective Au
Peelable Mask Carbon Ink
Controlled Impedance Laser Drill
Score Punch and Return
Via-In-Pad Blind Vias
Buried Vias Stacked Vias
Plugged Vias  
 
Special Materials
Getek Arlon
Ceramic Ohmega Ply
AD10  Stablcor
CIC  
 
Special Technologies  
HDI Cu Filled Vias
Bonded Heatsinks  
 
Special Panel  
Largest PCB Size 24 x 24 inches
Layer Count 1-44 Layers
 
Special Drill
Min PTH Mechanical 0.0079" (0.2 mm)
PTH Tolerance +/- 0.002" (0.05 mm)
 
Special Trace / Space
Min Trace/Space 0.002/ 0.002
 
Special Surface Finishes
Electroless Nickel / Immersion Palladium / Immersion Gold (ENIPIG)

All printed circuit quoted IPC-A-600 Class 2, IPC-6012 Class 3 quoted upon request

• Certifications
  ISO 9001:2008
  ITAR Compliant - On and Offshore
  UL certified
  TS 16949 Certified
  RoHS Compliant
  QS 9000 Compliant
  MIL-PRF-55110
  NADCAP AC 7119
  BS EN 9100: 2009 (AS 9100 Rev C)
  

• Additional BBG Services
  High-Mix, Low-to-High Volume: 2-5 Weeks, domestic and offshore
  Prototyping and Short Run: 3-5 day (domestic), 5-10 day (offshore)
  Engineering Support for: Stack Ups, DFMs and Impedance Models
  Logistics Programs: VMI, Consignment, Global Staging, Kan Ban
  Testing: IST, Hi-Pot, Flying Probe, Grid, TDR, Ionic, Solder Float

• Examples of the industries BBG serves
  Aviation
  Safety and Security
  Automotive
  RF
  Military and Aerospace
  Medical
  Industrial Controls
  Consumer Products
  Signage (LED)