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A PCBA Engineer's 10-Year Notes on Process Issue Resolution

392 0 Apr 18.2025, 22:37:34

Over the past decade, as an engineer specializing in PCBA processes, Ive encountered countless challenges, ranging from soldering defects and cold soldering to PCB warping and high-speed signal integrity issues. Behind each problem lies an experience worth documenting and sharing.The "Radical Cure" for Soldering DefectsSoldering defects are among the most common issues in almost all PCBA projects. When I first started in this field, I believed that adjusting the temperature profile properly could solve most soldering problems. However, reality is far more complex. For example, BGA solder joint voids and insufficient solder filling in plated through holes often originate from the PCB itself. During a chance collaboration, we switched to boards produced by PCBGOGO and found that under the same reflow parameters, the void rate was significantly reduced. This led me to reassess the weight of PCB manufacturing quality in the process.The "Silent Killer" of High-Speed SignalsAs products incre...