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What is a plating?voids? How to avoid it?
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Apr 23.2019, 09:32:54
The state of hole breaking is a phenomenon of point distribution rather than whole circle opening, which is called point hole breaking, and some people call it "plating?voids". The common causes come from the poor treatment of the rubber slag process. The circuit board degumming slag process will first carry out the expansion agent treatment, and then carry on the strong oxidant "permanganate" erosion operation, this process will remove the glue slag and produce the micropore structure. After the removal process of the residual oxidant, rely on reductant removal, the typical formula is treated with acidic liquid.
The damaged pore walls will not react in the subsequent palladium colloid and chemical copper treatment, and there will be no copper precipitation in these areas. If the foundation is not established, the electroplating of copper will, of course, not be completely covered and lead to punctate hole breakage. This kind of problem has already occurred in many circuit board factories, pay more attention to remove glue slag process reduction step potion monitoring should be able to improve, the above only for reference.
Because after the rubber residue treatment, there will no longer see the problem of residual rubber residue, operators often ignore the monitoring of the reduction acid, which may leave the oxidant on the pore wall. Then the circuit board enters the chemical copper process, after the whole hole agent treatment, the circuit board will carry on the micro-corrosion treatment, then the residual oxidant is immersed in acid again and the resin in the residual oxide area is peeled off, at the same time, it is tantamount to destroying the whole hole agent.
The damaged pore walls will not react in the subsequent palladium colloid and chemical copper treatment, and there will be no copper precipitation in these areas. If the foundation is not established, the electroplating of copper will, of course, not be completely covered and lead to punctate hole breakage. This kind of problem has already occurred in many circuit board factories, pay more attention to remove glue slag process reduction step potion monitoring should be able to improve, the above only for reference.
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