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True plated vias at home
So what do you need for this more advanced process?
1) what method can be used to drill the hole? I understand they use a carbide drill with a excess of 100k rpm in an air spindle. Can you drill a hole conventionally and use something like a microreamer to clean it up? An option here would be to make a custom drill press that uses an air spindle so the hole can be drilled correctly.
2) how is the chemical process done? I assume you need something like a rocker table or a combined ultrasonic process?
I know its hard and not economical. I wanted something better then the copperset via kit.
If you have alot of time, can you electrodeposit a lip around the hole then use a micrometer connected to an annode thats being gradually removed to grow a verticle layer downards then do lapping to clean it up?
In the ink method is there significant adhesion between the electroplate and the via wall?
Then when you grow a almost full shorted cylinder, use a micropipet to inject liquidy epoxy around the via growth pcb hole interface as its cooled to make a verticle wall bond then finish the plating? There is significant differential contraction so a copper tube grown along side a fiberglass wall should shrink and allow thin glue to enter under vacuum.
I dont like the ink idea for some reason
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