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For those that understand the details of PCB fabrication....this is for you.
As my layouts need to be smaller and smaller with parts on both sides - blind and buried vias are not just an interesting option but rather the ONLY option.
Trying to get an overview of what is possible first, then create a sample layout and send it to a few of my typical fabs to get DFM feedback from them. While I am aware that blind and buried vias rapidly increase cost - I am trying to build some understanding of what is easy, what is possible but difficult, and what is just stupid and don't ask for it.
Kind of like learning not to ask a machinist to drill a square hole.
Simple Example: 4 layer
Eagle naming is weird - 1-2-15-16 are the layer names
Through 1-16 - standard, easy
Blind 1-2 - seems standard
Blind 1-15 - ?? Not sure this won't raise flags
Blind 16-15 - seems standard
Blind 16-2 - ?? Not sure this won't raise flags
Buried 2-15 - seems standard
Are the blind vias from layer 1-15 (going through layer 2) something to avoid or is it no big deal?
I know that someone somewhere can fabricate any stack that I dream of, but the goal is to keep it in the realm of a typical pcb house. Does not need to be the bottom of the barrel or the super fancy aerospace exotic.
- Comments(1)
A****min
Oct 26.2019, 10:47:12
It really depends on the specific stackup process used by the specific fab line, in the simplest case:
a 4 layer board can be laminated both sides over a double sided core, or
be a pair of double sided units sandwiched together
For one of those buried vias are cheap and blind vias expensive, and the reverse for the other. You optimise cost when you follow the "standard" flow for the fab as closely as possible but the only people who can answer that are the people running your lines. As layer count grows it gets much more complicated and there may no longer be a default flow so you can get more choice in what you want without it costing "more" since its all one off pricing at that point anyway.
