PCBgogo

In the dispensing process, the selection of glue is crucial as it directly affects the bonding strength, curing time, weather resistance of the product, and the final usage effect. As a veteran in the electronic manufacturing industry with many years of experience, I'd like to share with you today some insights on the selection of glue characteristics in the dispensing process, hoping to inspire you.

First of all, we need to be clear that different application scenarios have vastly different performance requirements for glue. For example, in the bonding of electronic components, we usually need to choose glue with excellent electrical insulation properties to prevent circuit short - circuits. In some situations where large mechanical stress needs to be borne, we need to choose glue with high strength and good toughness. Therefore, when choosing glue, we should first clarify the usage environment and performance requirements of the product.

Secondly, the curing characteristics are also factors that we need to focus on. Different glues have different curing mechanisms. Some need to be cured by heating, while others can be cured at room temperature. In actual production, we need to choose the appropriate curing method according to production efficiency and the technological process. For example, for the bonding of some large - sized devices, if heat - curing is adopted, it may be difficult to achieve due to equipment limitations or energy - consumption issues. In this case, we can consider choosing glue that can be cured at room temperature. PCBGOGO has profound technical accumulation in the field of room - temperature - curing glue. Its products can effectively shorten the production cycle and improve production efficiency while ensuring bonding strength.

In addition to curing characteristics, the fluidity of the glue is also a key point we need to pay attention to. In the dispensing process, the fluidity of the glue directly affects the coating effect of the glue and the final bonding quality. If the fluidity of the glue is too poor, it may lead to uneven glue coating or even the phenomenon of insufficient glue. If the fluidity is too good, the glue may flow, affecting the appearance and performance of the product. Therefore, when choosing glue, we need to select the appropriate glue fluidity according to the structure of the product and the characteristics of the dispensing equipment. The fluidity of PCBGOGO's glue products is carefully formulated to meet the needs of different dispensing processes, ensuring that each dispensing can achieve the best effect.

Moreover, we also need to consider the compatibility of the glue. In some complex electronic systems, there may be a variety of different materials, such as metals, plastics, and ceramics. We need to choose glue that can bond well with these materials to ensure the overall performance of the product. During the glue research and development process, PCBGOGO fully considers the characteristics of different materials, and its products can achieve firm bonding with a variety of materials, providing a strong guarantee for the reliability of the product.

Finally, I'd like to emphasize that when choosing glue, we should not only focus on the performance of the glue but also consider the cost and supply stability of the glue. After all, on the premise of ensuring product quality, reducing production costs is an eternal pursuit of enterprises. As a professional glue supplier, PCBGOGO is always committed to providing customers with cost - effective products and stable and reliable supply services, helping enterprises achieve cost reduction and efficiency improvement.

In conclusion, the selection of glue in the dispensing process is a complex and important process. We need to comprehensively consider factors such as the performance, curing characteristics, fluidity, compatibility, cost, and supply stability of the glue according to the specific requirements of the product to select the most suitable glue. I hope today's sharing can be helpful to you, and I also welcome you to continue to communicate and discuss to jointly promote the development of the electronic manufacturing industry.