PCBgogo

In 5G communication PCBA design, effectively suppressing RF interference is crucial to ensuring communication quality and system reliability. Based on practical experience, PCBGOGO shares several strategies and techniques for RF interference mitigation in 5G communication PCBAs.

1. Characteristics of RF Interference in 5G Communication

5G communication operates mainly in Sub-6 GHz and millimeter wave frequency bands. Common sources of RF interference include:

• Co-channel interference

• Adjacent-channel interference

• Harmonic interference

• Spatial radiation interference

Strict Process Control:
Choosing an experienced PCB manufacturer that employs stringent process controls is essential to ensure board quality and performance. PCBGOGO, as a professional PCB manufacturer, is equipped with advanced production equipment and a robust quality management system, enabling them to deliver high-quality 5G communication PCBAs.

2. RF Interference Suppression Techniques for 5G Communication PCBA

1. Optimized PCB Layout

• Modular design: Group key components like RF chips, baseband chips, and power modules into distinct modules, maintaining proper spacing to minimize cross-interference.

• Partitioned layout: Separate sensitive circuits (e.g., receivers) from interference sources (e.g., transmitters, switching power supplies), and use shielding cans for isolation.

• Ground plane segmentation: Split digital and analog ground planes to prevent digital signals from interfering with analog signals.

2. Routing Optimization

• Differential routing: For high-speed signals, use differential pair routing to effectively suppress electromagnetic interference.

• Impedance matching: Ensure trace impedance matches the input/output impedance of RF chips to reduce signal reflection and standing waves.

• Minimize vias: Vias introduce parasitic capacitance and inductance, which can degrade signal integrity. Their use should be minimized.

3. Appropriate PCB Materials and Processes

Use high dielectric constant, low-loss PCB materials for RF circuit designs operating in 5G bands to maintain signal integrity and minimize loss.

4. Shielding and Filtering

• Shielding cans: Install shielding cans around RF chips and sensitive circuits to isolate them from external EMI sources.

• Filters: Add filters on power and signal lines to remove unwanted noise and interference. EMI filters and ferrite beads are common solutions.

• EMI absorbing materials: Apply EMI absorptive materials on the PCB surface to absorb radiated electromagnetic waves and reduce interference.

5. Grounding Design

• Single-point grounding: Connect the RF circuit’s ground pins to a single ground point to prevent ground loop interference.

• Large copper pours: Use extensive copper pours for grounding to reduce impedance and enhance grounding performance.

3. Conclusion

Through thoughtful PCB layout, optimized routing, proper material selection, effective shielding and filtering, and robust grounding design, RF interference can be significantly reduced, improving the performance and reliability of 5G communication devices. PCBGOGO, as a professional PCB manufacturer, brings extensive experience in the production of 5G communication PCBAs and is well-equipped to deliver high-quality products and services to clients.