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In the electronics industry, the tombstoning phenomenon of components has always been a troublesome issue. This article will share some technical experience and preventive measures regarding this phenomenon, hoping to provide a reference for engineers.

Causes of Component Tombstoning

Component tombstoning refers to the vertical displacement between the component body and the pad during the soldering process, resembling a tombstone. The main causes of this phenomenon are as follows:

• Component Issues: Such as dimensional deviations in component packaging and unreasonable pad design.

• Soldering Process Issues: Improper settings of soldering parameters like temperature, time, and solder amount.

• Environmental Factors: Including workshop temperature and humidity, static electricity, etc.

• Operator Skill Level: Improper operation can also lead to component tombstoning.

Preventive Measures

• Select High-Quality Components: Purchase components through regular channels to ensure their quality. For example, some brands have a good reputation in the industry and can provide stable quality assurance.

• Optimize Pad Design: Design the size, shape, and spacing of pads reasonably according to the characteristics of the components to improve soldering reliability.

• Strictly Control Soldering Process: Adjust soldering parameters to ensure a stable soldering process. For example, you can refer to the soldering parameter settings of well-established companies in the industry.

• Improve Production Environment: Maintain suitable temperature and humidity in the workshop and enhance static electricity protection measures.

• Enhance Operator Skills: Strengthen training to improve operators' mastery of the soldering process.

By implementing these measures, the tombstoning of components can be effectively prevented. Of course, in actual production, adjustments should be made flexibly according to specific conditions. It is hoped that the sharing in this article will be helpful to everyone.