PCBgogo

As AI glasses continue to pursue ultra-lightweight wearability, the internal PCB must fit into extremely limited spaces—typically within 20 mm × 30 mm—while still integrating a processor, sensors, power management, and wireless modules (Wi-Fi 6 / Bluetooth 5.3).

Industry data shows that 60% of AI glasses R&D failures are caused by insufficient PCB miniaturization. One manufacturer even delayed launch by three months because their PCB exceeded 25×35 mm, resulting in only 65% assembly yield at the glasses frame.

With 5 years of micro-PCB expertise, PCBGOGO has delivered 800,000+ small-form-factor PCBs, reaching minimum sizes down to 12×15 mm, serving over 30 leading AR/VR brands.
This guide breaks down the core design parameters, engineering constraints, and integration strategies that help hardware engineers overcome miniaturization bottlenecks.

1. Key Technologies in AI Glasses PCB Miniaturization

Miniaturizing PCB designs for AI glasses must follow IPC-2221 Section 5.4 guidelines on micro-PCB design. The challenge focuses on three engineering limits:

1) Fine Line Widths & Micro-Vias

• Traditional PCB: 0.2 mm line width, 0.3 mm hole size

• AI glasses PCB: 0.12–0.15 mm line width, 0.15–0.20 mm via diameter

• Must meet GB/T 4677 tolerance ±0.05 mm

PCBGOGO's lab tests show:

• Line width <0.12 mm increases etching break-risk by 30%

• Requires semi-additive process (SAP) for stability

2) High-Density Layer Stack

• Standard consumer PCB: 4–6 layers

• AI glasses: 8–12 layers, often with 3+2+3 symmetric HDI stacking

• Interlayer thickness: 0.08–0.10 mm

• IPC-A-600G Class 3 bubble rate requirement: ≤1%

3) Ultra-Small Component Integration

• Use of 01005 components (0.4×0.2 mm)

• Placement accuracy must reach ±0.02 mm

• Otherwise component shift rate can exceed 15%, especially around high-density SoCs and RF areas

Recommended Base Materials

Both materials pass PCBGOGO micro-PCB qualification and support stable 0.12 mm line-width mass production.

3. Practical Miniaturization Solutions

3.1 Four-Step Miniaturization Method

Step 1 — Layer Stack Planning

A typical 8-layer AI glasses PCB can use:
Signal – GND – Power – Signal – Signal – Power – GND – Signal

• Laminates: Shengyi S2116 at 0.15 mm / layer

• Prepreg: Panasonic R-1515, 0.05 mm per sheet

• Thickness tolerance: ±0.01 mm

• Stackup generated via PCBGOGO JPE-Layer 5.0

Step 2 — Defining Line Widths & Via Sizes

• Signal lines: 0.15 mm (1 oz copper), 50 Ω impedance

• Computed using Z = 60/√εr × ln(5.98h/W) with h=0.1 mm

• Power lines: 0.20 mm (supports 1 A current)

• Micro-vias: 0.20 mm, drilling accuracy ±0.01 mm

• Fabricated using PCBGOGO JPE-Laser-600

Step 3 — Component Layout Strategy

Follow: functional zoning + shortest routing

• Processor (Qualcomm XR2 Gen 2) centered for heat symmetry

• Cameras & microphones arranged around edges

• Wi-Fi 6 module placed outward to reduce interference

• Component spacing: ≥0.1 mm

• Altium Designer 23 + PCBGOGO DFM (JPE-DFM 7.0) for collision detection

Step 4 — Routing Optimization

• High-frequency lines (Wi-Fi 6) routed on surface layer; impedance controlled at 47.5–52.5 Ω

• Avoid vias for power traces to minimize IR drop

• Add ground shielding ≥0.1 mm for sensor signals following IPC-2221 6.2

3.2 Manufacturing Reliability Measures

Semi-Additive Etching Process (SAP)

• Thin copper deposition: 5 μm → patterning → plating up to 35 μm (1 oz)

• Achieves ±0.01 mm line-width precision

• Follows IPC-TM-650 2.3.17

Solder Mask Coating

• Liquid photo-imageable type (JPE-SR-800)

• Thickness 15–20 μm

• Coverage >0.05 mm to prevent creeping onto pads

Dimensional Inspection

• Per-batch sampling: 50 pcs

• Measured via JPE-Vision-900 at ±0.001 mm accuracy

• Dimensional yield target: ≥99.5%

Conclusion

Miniaturizing AI glasses PCBs requires a balanced combination of:

• High-density layer stacking

• Micro-scale line width & via reduction

• 01005 component integration

• Advanced processes like semi-additive manufacturing

Through its micro-PCB ecosystem—DFM pre-review, 0.1 mm laser drilling, SAP fine-line etching, and full-dimension inspection—PCBGOGO enables hardware engineers to confidently turn ultra-small PCB designs into reliable mass-production reality.