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Transparent PCBs: Flexible and Ceramic Circuit Boards with High Transmissivity

813 18 Jan 11.2023, 11:14:28
Transparent PCBs are an emerging technology that offers a new level of design freedom and possibilities. This technology allows for the use of light-emitting components and other optical components on the same board. The optical transmissivity of these transparent PCBs is quite high, allowing more light to pass through the board than traditional copper-clad PCBs. This could open up possibilities for a variety of applications in a range of industries, such as medical devices, automotive lighting, and military applications. Transparent PCB SubstrateTransparent PCBs may be made from two different substrates. Either ceramic or glass is used. Compared to glass, ceramic transparent PCB substrate has a higher heat conductivity. However, its transmissivity is a little bit lower. When compared to glass, which has a transmissivity of 99.5% to 99.99%, it is roughly 75 to 85%.Quartz and borosilicate glass make up the majority of the substrate for glass transparent PCBs. Of all substrates, they h...

Semi-Flex PCBs vs. Flex PCBs

3777 11 Dec 26.2022, 10:21:08
INTRODUCTION TO WHAT PCBs ARE:· Ever wondered how Phones, Televisions, Laptops and many other electronics that we use in our daily lives have become more and more lighter, that’s because of constant advancement in technology also the usage of even tinier microscopic gadgets that are being made by engineers to further take the usage of electronics on another level.· We all have a know how about certain microchips that are being worked up on upon to be even smaller but there are more to just microchips there’s a huge usage of PRINTED CIRCUIT BOARDS which have provided more ease to devices.· PRINTED CIRCUIT BOARDS or PCBs are circuits that are made to fit many components in a single place on a circuit within a device.· A PCB is made up of a glass fiber which is Copper coated placed on a circuit either mounted or etched.· In the past when all the components like connectors, capacitors, insulators, resistors, microchips etc were all separately put into a device ,it didn’t...

6 Tips for Transitioning from Schematic to Distribution

501 9 Oct 14.2022, 17:41:05
When transitioning the PCB schematic to the distribution design, there are many things to consider. To sum up, it is basically the following six things. Initial schematic transitionNote: All the examples mentioned were developed with the MulTIsim design environment, but the same concepts apply when using different EDA tools.I.Some Recommended Steps to Prepare for the Distribution Design Phase:· Set raster and units to suitable values. To achieve finer distribution control over components and traces, the device grid, copper grid, via grid, and SMD grid can be designed to be 1 mil.· Set the blank area and vias of the circuit board frame to the required values. PCB manufacturers may have specific minimum or nominal recommendations for blind and buried via settings.· Set the corresponding pad/via parameters according to the capability of the PCB manufacturer. Most PCB manufacturers can support smaller vias with a drill diameter of 10mil and a pad diameter of 20mil.· Set design rules as r...

7 tips for high-speed PCB-routing design

3936 8 Sep 03.2022, 10:08:27
1. Power Supply and Circuit RoutingMost of the time digital circuits need discontinuous current, which would generate inrush current. And there must exist parasitic inductance, parasitic resistance, and parasitic capacitor in the high-speed circuit, so eventually, the high-frequency noise would be coupled into other circuits. Because parasitic inductance will decline the maximum inrush current capability that can be withstood, and then cause some parts pressure to drop, and the circuit may be disabled.Therefore, it is particularly important to add bypass capacitors in front of digital devices. The larger the capacitor is, the more energy it transmits is limited by the transmission rate, so a large capacitor and a small capacitor are generally combined to satisfy the full frequency range.Avoid hot spots: Signal vias will create voids on the power plane and bottom layer. Therefore, the unreasonable placement of vias is likely to increase the current density in some areas of the power o...