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As 5G, artificial intelligence, and high-performance computing continue to evolve, the demand for printed circuit boards (PCBs) has shifted toward ultra-high density and miniaturization. One key enabling technology behind this revolution is the modified Semi-Additive Process (mSAP). To those outside the industry, PCB manufacturing might seem like a traditional field, but in reality, it’s full of cutting-edge innovations—and mSAP is one of them.
What Is mSAP and How Does It Work?
The semi-additive process (mSAP) is an advanced method for forming ultra-fine circuit patterns on PCBs. Compared to the traditional subtractive process, where excess copper is etched away from a fully coated board, mSAP takes a more precise approach.
In simple terms, mSAP involves:
Starting with a thin layer of copper-clad laminate.
Depositing a photoresist layer and exposing it with a laser direct imaging (LDI) system to define the circuit pattern.
Electroplating additional copper only where needed.
Stripping the photoresist and then using a quick micro-etching step to remove the very thin initial copper, leaving behind the desired circuitry.
This method allows trace widths and spacings of less than 20μm—far beyond what subtractive methods can achieve.
Why Is mSAP Essential for 5G and Beyond?
5G devices and infrastructure require signals to travel at extremely high frequencies with minimal loss. Traditional PCB fabrication often results in uneven trace geometries or undercutting during etching, leading to impedance inconsistencies and signal degradation.
With mSAP:
Circuits can be produced with near-vertical sidewalls and minimal width deviation.
This improves signal integrity in high-frequency scenarios, making it ideal for 5G mmWave applications, high-speed servers, and advanced radar systems.
Where Is mSAP Already Making a Difference?
IC Substrates: Advanced packaging for chipsets—especially in smartphones and AI accelerators—relies on mSAP for dense interconnects.
Server Motherboards: As data rates push beyond 112 Gbps, the need for precise impedance control makes mSAP the go-to technology.
Automotive Radar: Autonomous driving systems use mmWave radar PCBs made with mSAP for improved accuracy and reliability.
Major players in Asia have been quick to adopt mSAP, but in recent years, Chinese PCB manufacturers have made significant progress in scaling this technology—supporting broader supply chain independence in high-tech sectors.
The Future of mSAP and Industry Trends
The trend toward smaller, faster, and more efficient electronics isn’t slowing down. With the arrival of 6G research and more sophisticated IoT devices, mSAP will play an even greater role.
New developments include:
Combining mSAP with embedded component technology.
Using advanced substrate materials like liquid crystal polymer (LCP) for even higher frequency performance.
Improving sustainability through reduced copper and chemical usage.
Conclusion: Where PCBgogo Fits into the mSAP Story
At PCBgogo, we’re not just observers of this technological shift—we’re active participants. As a manufacturer and service provider specializing in quick-turn and high-quality PCB production, we have embraced mSAP in our high-density interconnect (HDI) and RF board offerings.
We understand that innovation isn’t just about having the best equipment; it’s about mastering the process and responding to what the market needs. Whether it’s supporting startups in prototyping or volume production for industrial clients, we’re committed to integrating advanced techniques like mSAP where it matters.
Our goal is simple: to help designers and engineers turn groundbreaking ideas into reality—with precision, reliability, and speed. The future of PCBs is finer, faster, and more functional. And with mSAP, we’re ready for it.
