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PCB manufacturing flow chart

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  • In blog
  • Tuesday, 22 May 2018

PCB manufacturing process

1Plated Through Hole: drillcoatingthickening

2generating pattern: light painted/photographic plategenerating circuit patternetchingTin stripping.

3other: gold fingerprinted

4surface treatedHALOSPplating Ni/Au

5Finished processprofile by routingtestingpackaging

Single-sided process flow:

Cutting edgedrillingexternal pattern tin platingetchingtin strippingtestingsolder maskhot air leveling(HAL)silk screenprofiling processtesting storing

Double-sided board process flow:

Cutting edgedrillingPTH thickeningexternal patterntin platingetchingtin strippingsecond drillingtestingsolder maskgold fingerhot air leveling(HAL)silk screenprofiling processtestinginspectingpackaging





Double-sided board plating Ni/Au process flow:


Cutting edgedrillingplated through hole(PTH)external patternplating Ni/Austripping etchsecond drillingtestingsolder masksilk screenroutingtestinginspectingpackaging.


Multilayer_ board HAL process flow:


Cutting edgedrilling tooling holeinner patterninner etchinginspectingblack oxidation laminatingdrillingplated through hole(PTH)external patterntin platingetchingtin strippingsecond drillinginspectingsolder maskgold fingerhot air leveling(HAL)silk screenprofiling processtestinginspectingpackaging


Multilayer_ board immersion gold process flow:


Cutting edgedrilling tooling holeinner patterninner etchinginspectingblack oxidation laminatingdrillingplated through hole(PTH)external patternplating Ni/Austripping etchsecond drillinginspectingsolder masksilk screenprofiling processtestinginspectingpackaging


Immersion gold board process flow of multilayer_ board:

Cutting edgedrilling tooling holeinner patterninner etchinginspectingblack oxidation laminatingdrillingplated through hole(PTH)external patterntin platingetchingtin strippingsecond drillinginspectingsolder maskElectroless nickle immersion gold(ENIG)silk screenprofiling processtestinginspectingpackaging

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